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Features
Silylation Reaction: The trimethoxysilyl group in the molecule hydrolyzes to form siloxane bonds with inorganic material surfaces.
Epoxy Group Reaction: The epoxy group can undergo ring-opening reactions with various compounds containing active hydrogens, such as amines, alcohols, and carboxylic acids, thereby connecting organic and inorganic materials.
Multifunctionality: It possesses both silane and epoxy groups, enabling it to react with both inorganic and organic materials.
High Reactivity: The epoxy group is highly reactive and can react with a wide range of compounds.
Good Compatibility: GPTMS is soluble in both organic solvents and water, making it easy to use.
Applications
Kemsylan E301 is a crucial organosilane coupling agent with broad applications in materials science, electronics, and biomedical engineering. Its unique molecular structure and multifunctional properties make it valuable in improving material properties and creating novel materials.
-Adhesion Promoter
Enhanced Composite Properties: Kemsylan E301 significantly improves the interfacial bond between reinforcement fibers (like glass fibers, carbon fibers) and the matrix resin in composite materials, enhancing the mechanical properties such as strength and toughness.
Improved Coating Adhesion: Kemsylan E301 enhances the adhesion of coatings and paints to various substrates (like metals, glass, plastics), extending the coating's lifespan.
-Surface Modification
Increased Surface Activity: The epoxy group in Kemsylan E301 makes the material surface highly reactive, allowing it to react with a variety of substances and introduce various functional groups.
Improved Crosslinking Density: The epoxy group's ring-opening reaction can increase the crosslinking density of the material surface, improving the material's heat resistance, chemical resistance, etc.
-Preparation of Organic-Inorganic Hybrid Materials
Sol-Gel Process: Kemsylan E301 can be used as a cross-linking agent in the preparation of organic-inorganic hybrid materials, such as organic silicon gels.
-Other Applications
Electronics Industry: Used in electronic packaging materials, printed circuit boards.
Biomedical Engineering: Used for the preparation of biosensors, drug carriers, etc.
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